IC Diamond Thermal Compound Review

Posted by Gilgamesh on August 26th, 2009

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Introduction

What helps a good thermal compound to become a great product? In the younger days of computing one would have automatically have said lower temperatures and that would be that. However the industry has matured, as such consumers are demanding more and more applications for their money. For example conductivity is a question; ergo will it conduct an electric current?Â Next is viscosity, how liquid is it? Is it suitable for delicate tasks such as PWM and GPU applications? These and many other questions need to be asked for all contenders to the throne of Thermal Compound king’.

Innovation Cooling have used a rather unique method by using neither silver nor a form of ceramic, but instead synthetic diamond. You have read correctly; seven carat synthetic diamond! A rather unique method of using crushed diamond into a paste which is then applied directly to the CPU or component in question.

Innovation cooling is a privately held company, established in 2007 with a an extensive background knowledge of electronics cooling disciplines related to air cooling, water cooling, phase change cooling, and materials and manufacturing. Innovation Cooling’s principle objective is to develop cost effective, competitive performance products and transition them from lab to market. IC Diamond is the first of a series new products. Other products that are in the pipeline for release are two new compounds that will be introduced Q3 & Q4 this year. This is in addition to a new type of phase change heat sink in Q2 2010.”

Before going further in this review, we would like to thank Andrew Lemont at Innovation Cooling. He provided overclockerstech with the review samples. For those in the Uk whom wish to purchase this product then try www.specialtech.co.uk

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Specifications

Each tube of IC Diamond Thermal grease contains 7 carats of micronized diamond with diamond particle loadings @ 94% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.

Excellent thermal impedance
Tight particle distribution
40 u maximum particle diameter
Silicone free
Lower Viscosity
Greater stability
Non capacitive or electrically conductive

(http://innovationcooling.com/ICDDatasheet.htm last accessed 15/8/09)

IC Diamond comes in a 1.5 gram tube, which in theory is good for at least nine installations. The actual weight though is not specified on the sringe, rather the weight was obtained from visiting the innovationcooling website.

Testing

Testing Methodology

IC Diamond compound was tested with a number of popular compounds, within a temperature controlled environment. Tests were undergone by using the fan speed and temperature method. I.E fans full-CPU idle, Fans Full CPU full load. Idle temperatures were taken after one hour of 100% CPU load using Prime95. The processor was then left to cool down naturally for 30 minutes and only then were the idle temperatures taken. All ambient Air temperatures were at 25.7c

The same application procedure was used on all test, by placing a small ‘blob about 5mm in size at the centre of the CPU and the weight of the waterblock was used to spread the compound evenly.

Testing equipment:

Core I7 (C0 Stepping) CPU
Watercool Heatkiller CPU block with backing plate
DFI X58 T3EH6 DK motherboard
Thermochill PA 140.3 Prototype (old 16mm fan spacing)
3X SHarkoon 140mm Mid-range fans 64cfm each
2X GTX 260 in SLI mode air cooled
3x1gig of DDR3 1866 ram @1.65 volts (Corsair Dominator Ram)

Bios Settings used through-out the test:

Gilgamesh reviews are open and honest about our BIOS settings. We don’t jealously guard our methods; rather we prefer to openly share them with our readers. This is in order for our audienceÃ‚Â to repeat the same tests for themselves!

Genie BIOS Settings 2.66Gigahertz

CPU Features Sub Menu
Set VR Current Limit Max………………..Disabled
Thermal Management Control………….Disabled
EIST Function………………………………Disabled
CxE Function……………………………….Disabled
Execute Disable Bit……………………….Disabled
Virtualisation Technology……………….Disabled
***** Logical Processor Setting *****
Intel HT Technology………………………Enabled
Active Processor Cores…………………..All

DRAM Timing Sub Menu
Memory Control Setting………………….Auto
Memory LowGap…………………………..1563M
DRAM Command Rate…………………….2N
CAS Latency Time (tCL)………………….9
RAS# to CAS# Delay (tRP)………………9
RAS# Precharge (tRP)……………………9
Precharge Delay (tRAS)………………….24
REF to ACT Delay (tRFC)…………………Auto
Write to Pre Delay (tWR)………………..Auto
Rank Write to Read (tWTR)…………….Auto
ACT to ACT Delay (tRRD)……………….Auto
Row Cycle Time (tRC)……………………Auto
Read CAS# Precharge (tRTP)………….Auto
Four ACT WIN Time (tFAW)……………Auto

Voltage Setting Sub Menu
O.C. Shut Down Free…………………….Enabled
CPU VID Control…………………………..Auto
Power Saving………………………………STD
Super VID…………………………………..OFF
Vcore Auto PSI…………………………….Disabled
OCP………………………………………….140A
DRAM Bus Voltage………………………..1.65V
DRAM PWM Switch Frequency…………Nominal Frequency
DRAM PWM Phase Control……………..2 Phase Operation
CPU VTT Special Add……………………Auto
CPU VTT Voltage…………………………1.42
VTT PWM Switch Frequency…………..Nominal Frequency
VTT PWM Phase Control………………..2 Phase Operation
CPU PLL Voltage…………………………..1.80v
IOH/ICH 1.1v Voltage…………………….1.11v
IOH Analog Voltage……………………….1.10v
ICH 1.5 Voltage……………………………1.5v
ICH 1.05v Voltage…………………………1.05v
DIMM 1/2 DQ/DQSTB Bus VREF………..0%
DIMM 3/4 DQ/DQSTB Bus VREF………..0%
DIMM 5/6 DQ/DQSTB Bus VREF………..0%
DIMM 1/2 ADDR/CMD Bus VREF………..0%
DIMM 3/4 ADDR/CMD Bus VREF………..0%
DIMM 5/6 ADDR/CMD Bus VREF………..0%
CPU Core DQ/DQSTB Bus VREF………..0%
CPU QPI Drive Strength………………….Normal
IOH QPI Drive Strength………………….Normal

Genie Main Menu (Cont)
Exit Setup Shut Down…………………..Mode2
O.C. Fail Retry Counter…………………Enabled
O.C. Fail CMOS Reloaded………………Disabled
PPM Function……………………………..Enabled
Turbo Mode Function……………………Enabled

x 1 Core Max Turbo Ratio………………22x
x 2 Core Max Turbo Ratio………………21x
x 3Core Max Turbo Ratio……………….21x
x 4 Core Max Turbo Ratio………………21x

CPU Non-Turbo Clock Ratio……………20x

*BCLK/UCLR/QPI Controller Settings*

QPI Control Settings……………………Enabled
QPI Link Fast Mode……………………..Enabled
QPI Frequency GT/sec…………………Auto
CPU Base Clock (BCLK)……………….133
Boot Up CPU Base Clock………………Auto
PCIE Clock……………………………….100MHz
DRAM Frequency……………………….BLCK*14
Uncore Frequency……………………..BLCK*28

CPU Spread Spectrum………………..Disabled
PCIE Spread Spectrum……………….Disabled

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The Contenders

Shown below moving from left to right are IC Diamond, Artic Ceramique, Artic Silver 5 and Shin-Etsu X23 thermal compounds.

Artic Silver 5

Artic Silver has been around for many a year and all new compounds benchmark their products with it.. Known as the ‘Grand Daddy’ of thermal compounds it is known everywhere in the computer cooling industry and is the main-stay of thermal compounds! Though there ARE compounds that beat Artic Silver 5 hands-down it still is a product worth benchmarking against, as everyone knows of this thermal paste. The issue however with this compound is that since it contains flakes of silver, then this makes the compound capacitive. It should be fine for the CPU or the North and Southbridge. However for more delicate work such as PWM modules and GPU work it could never be recommended. In addition as far as thermal compounds go this would be of a mid-level viscosity. Artic Silver 5 is however crippled by its exceedingly lengthy curing time of two hundred hours.

Results:

Fans Full-CPU Idle	Fans Full- CPU Full

Fans Low-CPU Idle	Fans Low-CPU Full

Artic Ceramique

Artic Cermique shares a passing resemblance to the standard white goop that comes bundled in with various heatsinks. However this is where the comparison ends, as this compound uses a combination of Aluminium oxide, Boron nitride and Zinc. Unlike Artic Silver 5 however, Ceramique is non conductive and is ideal for of the more delicate work on Graphics cards, as well as their MOSFETS. Offering a similar viscosity as its older brother, it is just as easy to apply to a wide range of applications. However what does set Artic Cermique apart from the rest in the comparison test today is its operating temperature. This is one of the few compounds that can take temperature of minus 180 degrees-c! This makes it deal for the use of sub-ambient cooling, such as Phase-Change, Dry- Ice or liquid Nitrogen.

Results

Fans Full-CPU Idle	Fans Full-CPU Full

Fans Low-CPU Idle	Fans Low-CPU Full

Shin-Etsu X23

Now that the standard compound tests have been completed, it is time to put IC7 Diamond to a more powerful test. Shin-Etsu is not well known and is often overlooked by most people. However it is one of the best performing compounds out on the market, simply demolishing rivals with ease. DFI bundled this with their high-end motherboards. Having used this for a number of years, one would freely admit that we are a fan of this compound.

A full sample of this product did not arrive for testing on time. However a quick raid of a DFI accessory box proved fruitful with two tubes of X23. With next to no curing time and a great reputation it was with eager hands that this compound was placed upon the CPU. As usual the viscosity of the X23 compound is very thick and is very difficult to spread. There are various techniques available upon the internet used to warm this compound up, making it easier to spread. However there had to be a more simple way, so this reviewer pefected a new technique.

Set the BIOS back to stock speeds ( if overclocked)
Take of Heatsink/Waterblock and clean CPU with Isopropol
Leave for a few moments then apply the compound.
Switch on the computer WITHOUT the heatsink /block installed
Leave on for between five to ten seconds until the CPU is warm
Switch off then immediately install the heatsink/waterblock, this spreads the compound evenly.

Test Results

Fans Full-CPU Idle	Fans Full-CPU Full

Fans Low-CPU Idle	Fans Low-CPU Full

IC Diamond

IC Diamond a rather unique product, using (as the name suggests) synthetic diamond. The thermal properties of this product promise that it will be amongst the leaders in the race for the throne of ‘Thermal Compound King!Â What is interesting to note is that this product has no electrical conductivity so it is safe to use on the most delicate of components, such as the Mosfets placed on a graphics card.Ã‚Â An important thing that is worth noting before use -is that this compound (since it is made from diamond) makes an excellent polishing compound. So much so that it is not unheard of for the Intel markings upon the top of your CPU being polished off! BUt this is only after at least a year of changing the compound every week or evenÃ‚Â every few days.

Be aware that the curing time on this product is dependant upon the IHS of your CPU. So this could be anything from two hours to one week!

The thermal properties of this compound look rather promising, however as they say the proof is in the pudding. So let us move on from here.

Results

Fans Full-CPU Idle	Fans Full-CPU Full

Fans Low-CPU Idle	Fans Low-CPU Full

As with the Shin-Etsu compound for best use please use the below method of application

Set the BIOS back to stock speeds ( if overclocked)
Take of Heatsink/Waterblock and clean CPU with Isopropol
Leave for a few moments then apply the compound- a small blob in the centre of the CPU at around 5mm in size.
Switch on the computer WITHOUT the heatsink /block installed
Leave on for between five to ten seconds until the CPU is warm
Switch off then immediately install the heatsink/waterblock, this spreads the compound evenly.

Two more thermal compounds were due to be tested in this roundup. OCZ Freeze and Indigo Extreme, as of yet the samples failed to arrive on time for the review.

For your convenience a series of graphs has been added to this review outlining all the temperature results displayed above.

Average Temperature Results

Maximum Temperature Results

Delta Results

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Summary and Conclusion

IC Diamond has done a rather good job with this compound, however as proven the results can vary. With only three to four degrees lead over Artic Silver 5 and one to two over other leading compounds such as the Shin-Etsu x23, it could be asked if the process worth it? However the other side of the coin is two fold. There is the fact that overclocking enthusiasts are willing to go to extreme lengths to shave off that extra degree and lastly that the results are dependant on the heat spreader of your particular CPU.

Due to the viscosity of Innovation Cooling’s compound it could be conceivably replace the thermal pad used on the PWM modules. In addition its non conductive nature it can be used in a variety of applications and not just for the CPU. However in all fairness this only happens when the compound has been changed on a regular basis(such as when testing differing processors

The compound does perform well once its cured and as previously mentioned it can be used in a variety of applications. The delta was the second lowest in our round up, coming in a close second to the Artic Ceramique. On a majority of tests it was a rival and indeed came ahead of the next overall best solution the Shin-Etsu X23.

The overclocking results also proved to be an interesting, as it appears that the more this compound is pushed the harder it works so to speak. A quick test prooved this with IC7 performing at its maximum of 66C and Artic Silver 5 at 73c when overclocking to 4 gigahertz! The only disadvantage is that this compound has a temperature range is only from minus thirty degrees, rendering it unsuitable for Dry Ice or Liquid Nitrogen cooling. It is possible however to perform a Fast cure by the use of a hairdryer to enable the compound to be suitable for the aforementioned cooling style. Also given that the Artic Cermique is the cheapest compound in this reviews roundup, it also has the LOWEST delta. One possible explanation for this is that since this compound is more suitable for sub-zero cooling I.E -180 degrees then it could explain why the delta is the lowest.

All in all the IC Diamond puts up a tough fight even with the excellent Shin-Etsu compound (of which has the next best overall results) Based on these performance figures one would have no hesitation in recommending IC Diamond’s solution for a variety of cooling applications.

Pro’s

Does indeed reduce temperatures
Non-Conductive
Viscosity (able to be used on a vairety of components and is not limited to the CPU)
Performs better than Shin-Etsu x23
Delta Temperatures are excellent
Curing times are low, BUT can vary from CPU to CPU
Works well even under extreme Overclocking situations

Con’s